Polyimide (PI) film is the backbone material of modern flexible electronics. From smartphone displays to EV battery insulation, PI film unique combination of thermal stability, electrical insulation, and mechanical flexibility makes it irreplaceable in applications where failure is not an option.
Material Properties Why PI Film Performs Where Others Fail
Standard PI film maintains its mechanical and electrical properties across a temperature range of -269C to +400C, a wider operating window than virtually any other flexible polymer. Key properties include: dielectric strength 150-300 kV/mm, dielectric constant 3.4 at 1 kHz, tensile strength 165-230 MPa, elongation at break 30-80%, and flame retardancy per UL94 V-0.
LiiFoo PI Film Range Three Types for Different Requirements
Standard PI Film (HN Type): General-purpose Kapton-equivalent film. Available in thicknesses from 12.5 micrometers to 125 micrometers. Ideal for flexible printed circuits, insulating barriers, and general-purpose electrical insulation.
High-Temperature PI Film (HT Type): Enhanced thermal stability up to 500C continuous exposure. Used in aerospace wire and cable insulation, pressure-sensitive tape backings, and thermal insulation in semiconductor diffusion furnaces.
Black PI Film: Carbon-pigmented for light-blocking applications. Opacity greater than 99% across the visible spectrum. Primary applications include display cover layers, LED module packaging, and optical sensor shielding.
Processing and Fabrication
PI film can be die-cut, laser-cut, or CNC machined to final part geometry. For adhesive lamination, silicone-based pressure-sensitive adhesives bond well to PI film surface after corona treatment. For metallization (common in capacitive sensors and RFID antennas), aluminum or copper sputtering with thicknesses of 50-500 nm adheres reliably to plasma-treated PI film.
Contact LiiFoo technical team for sample requests and technical specifications at https://liifoo.cn.
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